Abstract German manufacturer Schmid has announced the development of a new diamond wire-cut polysilicon wafer texturing process. It also said that its first batch of new technology systems will be available for sale in the second quarter of 2017. The new system developed by Schmid is also known as DWPr...
German manufacturer Schmid has announced the development of a new diamond wire-cut polysilicon wafer texturing process. It also said that its first batch of new technology systems will be available for sale in the second quarter of 2017. The new system developed by Schmid, also known as DW PreTex, can be used to enhance wafer surface roughening in order to achieve a texturing process. Schmid said the process is very cost effective and easy to implement.
The company said it has already acquired the first 500 MW orders and is expected to receive another 5 GW in 2017.
Several manufacturers, including SolarWorld, have invested in diamond wire saw technology to significantly reduce the cost of wafer production. However, the smooth surface left by the diamond wire cut poses a problem for the manufacturer during the texture phase. Schmid currently claims to have solved this problem through innovative materials processes often used in the photovoltaic industry. (Text / Tina compiled)
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