Dongfang Nanxing silicon carbide semiconductor material wire cutting special blade material technical transformation project started

On November 8, 2010, the commencement ceremony of the technical transformation project of Ningxia Oriental Nanxing Abrasive Materials Co., Ltd. was successfully held. It is understood that Dongfang Nanxing Company will significantly improve the economic benefits after the implementation of the special blade material technology transformation project for silicon carbide semiconductor material wire cutting, among which: the company's product direct yield increased by 8%, product transportation and packaging loss decreased by 0.5. %, the production capacity will be increased from 25,000 tons per year to 30,000 tons per year. The product quality is more stable and consistent, the working environment has been improved significantly, and the labor intensity is greatly reduced.
The specific content of the project includes:
1. Implementing technology and equipment for vacuum conveying silicon carbide materials to achieve local dust-free operation; sedimentation and centrifugation equipment instead of plate and frame filtration to improve the direct yield and yield of graded slurry; new mixing process to improve product consistency Sex
2. Automatic packaging instead of manual packaging, improve work efficiency, reduce labor intensity, reduce process pollution, beautiful packaging and specifications; vacuum closed transport replaces forklifts and electric hoists, reduces process pollution, reduces environmental pollution, reduces material loss, and improves labor Efficiency and protection of employees' physical and mental health.

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