1. Application of ceramic bond diamond grinding wheel
Ceramic bond diamond grinding wheel has the common characteristics of diamond and ceramic bond. Compared with ordinary corundum and silicon carbide grinding wheel, it has strong grinding force, low temperature during grinding and relatively small grinding wheel wear; it can adapt to various coolants. The role of the grinding wheel during grinding is good, the precision of grinding the workpiece is high; there are more air holes in the grinding wheel, which is good for chip removal and heat dissipation during grinding, not easy to block and not easy to burn the workpiece; self-sharpness of the grinding wheel It is better, the trimming interval is long, and the trimming is easier. Therefore, the use of ceramic bond diamond grinding wheels in some developed countries abroad is increasing.
With the development of science and technology, new materials are constantly growing, and mechanical processing is developing in the direction of high quality, high precision, high efficiency and automation. The application range of ceramic bond diamond grinding wheels is wider and wider, and the dosage is increasing. Mainly used in rough grinding, fine grinding and super fine grinding of diamond tools, cubic boron nitride tools, hard alloys and new engineering ceramic materials, cermet, cast iron, ceramics, gemstones, ferrite, concrete, refractory materials, fiber Reinforced grinding and processing of plastics.
Diamond tools are mainly concentrated in PCD composites, chemical vapor deposition (CVD) coated tools and single crystal diamond tools. Selecting reasonable process parameters, ceramic bond diamond grinding wheel for grinding single crystal diamond, the grinding efficiency is higher than that of metal bond grinding wheel, the wear ratio is very small, and the processing cost is low. Therefore, grinding ceramic single crystal diamond with ceramic bond grinding wheel can greatly improve Breaking the grinding efficiency. In the grinding of PCD tools, because the resin binder is soft, it is easy to deform during grinding, and the PCD tool cannot be effectively ground. The metal bond has poor self-sharpness due to the strong bonding ability to the abrasive grains, and the grinding efficiency is poor. Low, and the metal bond grinding wheel will cause the most serious damage to the edge of the PCD tool; the comprehensive grinding efficiency, the durability of the grinding wheel and the processing quality of the workpiece surface, the ceramic bond diamond grinding wheel is the most suitable choice for grinding PCD tools.
Fine-grained ceramic bond diamond grinding wheels are used for precision sizing of chrome-hardened steel bearing rollers.
Ceramic bond diamond grinding wheel is used for precision machining of automobile, tractor crankshaft and hydraulic pump gear neck.
The ceramic bond diamond wheel with better toughness is used for rough grinding and fine grinding of the TV tube fluorescent screen. High-performance silicon wafers for integrated circuits are processed by ceramic bond diamond grinding wheels, which have high processing precision, low processing roughness, and no metal ion contamination of the silicon wafer after grinding, and the qualified rate of processed products is high.
New engineering ceramic materials are made in science and industry due to their excellent properties such as high hardness, high wear resistance, high temperature resistance, corrosion resistance, high stiffness to weight ratio, low density and strong chemical inertness. The application is increasingly widespread. For example, MgO single crystals are widely used in high-temperature superconducting, film substrates, and laser parts. The use of these new materials is prone to brittleness and cracks during processing, often accompanied by a large number of processing problems. Diamond is the hardest material in nature, and the grinding wheel made of it solves the problem of processing high hardness materials such as glass and ceramics. For newly developed engineering ceramics such as silicon nitride, when grinding with a resin or metal bond diamond grinding wheel, it is easy to cause insufficient binding force of the bonding agent to the abrasive grains, and the abrasion is increased; or the toughness of the bonding agent is too large, in the grinding wheel The pores are small, the grinding force is reduced, and it is difficult to trim after the grinding wheel is blunt, which makes the entire grinding process difficult. The ceramic bond is ceramic or vitreous, the bond is rigid, can withstand high temperatures, is suitable for finishing when grinding, and does not cause knife knives. Moreover, the ceramic bond has strong adhesion to the abrasive grains, good angular retention performance, and high-precision grinding. In addition, the ceramic bond diamond grinding wheel can be adjusted in hardness and pores during the manufacturing process, which is beneficial to the improvement of the grinding performance. Without reasonable ratio and production control, no deformation will occur, which is also a high precision of the grinding wheel. the reason.
When summed up to grind with a ceramic bond diamond grinding wheel, it has the following advantages;
(1) High grinding efficiency;
(2) It has high wear resistance: the wear resistance of the grinding wheel is high, and the abrasive grain consumption is small, especially when grinding a very hard and brittle workpiece;
(3) The grinding force is small and the grinding temperature is low;
(4) The workpiece is ground with high precision, good surface quality, and good shape retention of the workpiece.
Therefore, the ceramic bond diamond grinding wheel has more and more obvious advantages in the grinding process of some special materials such as ceramics, and has a good prospect in the development of the diamond grinding wheel. It is considered to be a high-performance grinding wheel with high speed, high efficiency, high precision, low grinding cost and low environmental pollution. It has more and more widely used applications and is a hot spot in the research and development of grinding tools in the world.
Second, the existing problems
However, due to the characteristics of diamond, it has special requirements for the performance of ceramic bond. Therefore, the domestic ceramic bond diamond grinding wheel has not been widely used. Domestic diamond grinding wheels are mainly resin and metal bonding agents, and the amount of ceramic bonding agents is still small. The main reasons are: [1] due to the low-temperature binder used in the production of diamond grinding wheels, in order to reduce the refractoriness, a large amount of alkaline materials are introduced into the bonding agent, and the low-temperature ceramic bonding agent thus obtained has various properties (low refractoriness and low thermal expansion). Coefficient, strength, etc.) are difficult to control; [2] In the manufacturing process, due to the inertness of the super-hard material, the bonding agent has poor wettability and adhesion to the abrasive particles, reducing the bonding strength of the bonding agent to the abrasive grains, the grinding wheel In the grinding process, the abrasive particles fall off quickly and the wear is large; [3] In the grinding process, due to the high brittleness of the ceramic, the impact resistance and fatigue resistance of the grinding wheel are poor during use, and brittleness is likely to occur during use. The cracking phenomenon affects the grinding characteristics of the grinding wheel, and the thermal conductivity of the ceramic is poor, and the local temperature of the grinding region is high, so that the super-hard abrasive particles are easily lost in heat, and the grinding characteristics of the grinding wheel are also affected. This directly affects the use of ceramic bond diamond wheels.
III. Research Status In order to solve the above problems, scientific and technological workers have carried out research from various aspects, in which the performance of low temperature ceramic bond is a key factor affecting the quality and development of ceramic cement wheel. Therefore, research on low-temperature ceramic cements with high strength, low temperature and low expansion coefficient is the focus of research on super-hard material ceramic grinding wheels at home and abroad.
TanakaT, EsakiS, NishidaK, etc. can further improve the self-sharpness of the super-hard material set of grinding wheels by selectively increasing the number and size of the pores in the grinding wheel.
Jackson MJ, BarlowN, MillsB control the pore structure in the super-hard material ceramic grinding wheel to make the grinding wheel with high bond strength, good grinding efficiency and cooling performance during grinding. Through thermomechanical analysis and Raman spectroscopy, Kuan-HongLin, Shih-FengPeng and Shun-TiabLin studied the sintering shrinkage rate and diamond burning loss of superhard ceramic wheel with sintering temperature, sintering atmosphere and sintering time. The sintering parameters and grinding characteristics of the ceramic bond diamond grinding wheel were studied. The formula of super-hard material ceramic binder used by Russian scholars is mainly based on the chemical composition, and the boron glass or boron-lead glass system is selected as the theoretical research object. Lead glass binders have also been studied intensively, but lead is a toxic substance that decomposes easily at high temperatures.
As early as the 1990s, Japanese researchers studied the selection of grinding wheel concentration and abrasive grain requirements for high-precision and high-precision grinding of ceramic bond diamond wheels. Study on the grinding performance of super-hard material grinding wheel with borosilicate glass system binder with Na2O-B2O3-SiO2 as the basic component; the formulation of ceramic binder is mainly based on chemical composition, and choose boron glass or boron lead glass system as Theoretical research object.
In foreign studies, the study of toughening and strengthening of ceramic binders began. For example, the crystal phase of the binder was microcrystallized, and appropriate amount of whiskers were added to the binder. They found that the addition of silicon borate whiskers to the binder can inhibit the formation of cristobalite and prevent the cracking of the grinding wheel due to the rapid expansion of the cristobalite at 100 ° C to 200 ° C. On the other hand, the aluminum borate whisker It can itself act as a whisker reinforcement to increase the tensile strength of the bond.
From the domestic research reports on superhard material ceramic grinding wheels, the research directions are mainly:
Coating the surface of the superhard material abrasive particles to form a transition layer increases the adhesion of the bonding agent to the abrasive particles.
Using glass, ceramic and other related theories to discuss borosilicate glass with Na2O-B2O3-SiO2 as the basic component, the free oxygen provided by R2O or RO, the boron-oxygen triangle [BO3] is converted into boron oxygen composed entirely of bridging oxygen. The tetrahedron [BO4] transforms the structure of boron from a layered body into a three-dimensional space-like structure similar to a silicon tetrahedron [SiO4], thereby strengthening the network and making certain properties of the glass appear on the property curve. Maximum and minimum values. The high strength is only a characteristic index of the grinding wheel, and the performance indexes such as impact toughness and wear resistance of the grinding wheel market must also be considered.
The research of ceramic bond diamond mainly comes from several aspects, [1] research on low temperature, high strength and low expansion coefficient ceramic bond; [2] performance improvement of ceramic bond; [3] ceramic bond and diamond abrasive grain Inter-wetting research; [4] Research on surface modification of diamond abrasive grains; [5] Research on improvement of grinding wheel structure; [6] Research on optimum preparation parameters of grinding wheel; [7] Optimal grinding process parameters and grinding methods Research, etc.
Due to the combination of ceramic binder and diamond abrasive, the difficulty factor is relatively large, and the development and production of ceramic bond diamond grinding wheel has been hindered. The engineer of Henan Shengchuang Superhard Material Co., Ltd. overcomes the technical problem of ceramic bond diamond. The engineer is the first to produce the ceramic bond diamond grinding wheel for grinding gemstone in China, and has developed a variety of grinding wheel specifications, which has won the favor of gem processing. . In recent years, the grinding and grinding of PCD/PCBN tool ceramic bond diamond grinding wheel, grinding diamond composite ceramic bond diamond grinding wheel and other series of ceramic bond diamond grinding wheel has achieved good reputation in the market. ["Interpretation of the Performance of Different Bonding Agents for Diamond Wheels" provides a detailed analysis of the performance of diamond grinding wheels with different binders. At present, the ceramic bond diamond grinding wheel is far from playing its due role. The research and development room of Henan Shengchuang Superhard Material Co., Ltd. shoulders the performance of ceramic bond, the structure of the grinding wheel, the process parameters of the grinding wheel preparation, the grinding processing method and the process parameters. Further research is conducted to meet the urgent needs of the domestic market.
Ceramic bond diamond grinding wheel has the common characteristics of diamond and ceramic bond. Compared with ordinary corundum and silicon carbide grinding wheel, it has strong grinding force, low temperature during grinding and relatively small grinding wheel wear; it can adapt to various coolants. The role of the grinding wheel during grinding is good, the precision of grinding the workpiece is high; there are more air holes in the grinding wheel, which is good for chip removal and heat dissipation during grinding, not easy to block and not easy to burn the workpiece; self-sharpness of the grinding wheel It is better, the trimming interval is long, and the trimming is easier. Therefore, the use of ceramic bond diamond grinding wheels in some developed countries abroad is increasing.
With the development of science and technology, new materials are constantly growing, and mechanical processing is developing in the direction of high quality, high precision, high efficiency and automation. The application range of ceramic bond diamond grinding wheels is wider and wider, and the dosage is increasing. Mainly used in rough grinding, fine grinding and super fine grinding of diamond tools, cubic boron nitride tools, hard alloys and new engineering ceramic materials, cermet, cast iron, ceramics, gemstones, ferrite, concrete, refractory materials, fiber Reinforced grinding and processing of plastics.
Diamond tools are mainly concentrated in PCD composites, chemical vapor deposition (CVD) coated tools and single crystal diamond tools. Selecting reasonable process parameters, ceramic bond diamond grinding wheel for grinding single crystal diamond, the grinding efficiency is higher than that of metal bond grinding wheel, the wear ratio is very small, and the processing cost is low. Therefore, grinding ceramic single crystal diamond with ceramic bond grinding wheel can greatly improve Breaking the grinding efficiency. In the grinding of PCD tools, because the resin binder is soft, it is easy to deform during grinding, and the PCD tool cannot be effectively ground. The metal bond has poor self-sharpness due to the strong bonding ability to the abrasive grains, and the grinding efficiency is poor. Low, and the metal bond grinding wheel will cause the most serious damage to the edge of the PCD tool; the comprehensive grinding efficiency, the durability of the grinding wheel and the processing quality of the workpiece surface, the ceramic bond diamond grinding wheel is the most suitable choice for grinding PCD tools.
Fine-grained ceramic bond diamond grinding wheels are used for precision sizing of chrome-hardened steel bearing rollers.
Ceramic bond diamond grinding wheel is used for precision machining of automobile, tractor crankshaft and hydraulic pump gear neck.
The ceramic bond diamond wheel with better toughness is used for rough grinding and fine grinding of the TV tube fluorescent screen. High-performance silicon wafers for integrated circuits are processed by ceramic bond diamond grinding wheels, which have high processing precision, low processing roughness, and no metal ion contamination of the silicon wafer after grinding, and the qualified rate of processed products is high.
New engineering ceramic materials are made in science and industry due to their excellent properties such as high hardness, high wear resistance, high temperature resistance, corrosion resistance, high stiffness to weight ratio, low density and strong chemical inertness. The application is increasingly widespread. For example, MgO single crystals are widely used in high-temperature superconducting, film substrates, and laser parts. The use of these new materials is prone to brittleness and cracks during processing, often accompanied by a large number of processing problems. Diamond is the hardest material in nature, and the grinding wheel made of it solves the problem of processing high hardness materials such as glass and ceramics. For newly developed engineering ceramics such as silicon nitride, when grinding with a resin or metal bond diamond grinding wheel, it is easy to cause insufficient binding force of the bonding agent to the abrasive grains, and the abrasion is increased; or the toughness of the bonding agent is too large, in the grinding wheel The pores are small, the grinding force is reduced, and it is difficult to trim after the grinding wheel is blunt, which makes the entire grinding process difficult. The ceramic bond is ceramic or vitreous, the bond is rigid, can withstand high temperatures, is suitable for finishing when grinding, and does not cause knife knives. Moreover, the ceramic bond has strong adhesion to the abrasive grains, good angular retention performance, and high-precision grinding. In addition, the ceramic bond diamond grinding wheel can be adjusted in hardness and pores during the manufacturing process, which is beneficial to the improvement of the grinding performance. Without reasonable ratio and production control, no deformation will occur, which is also a high precision of the grinding wheel. the reason.
When summed up to grind with a ceramic bond diamond grinding wheel, it has the following advantages;
(1) High grinding efficiency;
(2) It has high wear resistance: the wear resistance of the grinding wheel is high, and the abrasive grain consumption is small, especially when grinding a very hard and brittle workpiece;
(3) The grinding force is small and the grinding temperature is low;
(4) The workpiece is ground with high precision, good surface quality, and good shape retention of the workpiece.
Therefore, the ceramic bond diamond grinding wheel has more and more obvious advantages in the grinding process of some special materials such as ceramics, and has a good prospect in the development of the diamond grinding wheel. It is considered to be a high-performance grinding wheel with high speed, high efficiency, high precision, low grinding cost and low environmental pollution. It has more and more widely used applications and is a hot spot in the research and development of grinding tools in the world.
Second, the existing problems
However, due to the characteristics of diamond, it has special requirements for the performance of ceramic bond. Therefore, the domestic ceramic bond diamond grinding wheel has not been widely used. Domestic diamond grinding wheels are mainly resin and metal bonding agents, and the amount of ceramic bonding agents is still small. The main reasons are: [1] due to the low-temperature binder used in the production of diamond grinding wheels, in order to reduce the refractoriness, a large amount of alkaline materials are introduced into the bonding agent, and the low-temperature ceramic bonding agent thus obtained has various properties (low refractoriness and low thermal expansion). Coefficient, strength, etc.) are difficult to control; [2] In the manufacturing process, due to the inertness of the super-hard material, the bonding agent has poor wettability and adhesion to the abrasive particles, reducing the bonding strength of the bonding agent to the abrasive grains, the grinding wheel In the grinding process, the abrasive particles fall off quickly and the wear is large; [3] In the grinding process, due to the high brittleness of the ceramic, the impact resistance and fatigue resistance of the grinding wheel are poor during use, and brittleness is likely to occur during use. The cracking phenomenon affects the grinding characteristics of the grinding wheel, and the thermal conductivity of the ceramic is poor, and the local temperature of the grinding region is high, so that the super-hard abrasive particles are easily lost in heat, and the grinding characteristics of the grinding wheel are also affected. This directly affects the use of ceramic bond diamond wheels.
III. Research Status In order to solve the above problems, scientific and technological workers have carried out research from various aspects, in which the performance of low temperature ceramic bond is a key factor affecting the quality and development of ceramic cement wheel. Therefore, research on low-temperature ceramic cements with high strength, low temperature and low expansion coefficient is the focus of research on super-hard material ceramic grinding wheels at home and abroad.
TanakaT, EsakiS, NishidaK, etc. can further improve the self-sharpness of the super-hard material set of grinding wheels by selectively increasing the number and size of the pores in the grinding wheel.
Jackson MJ, BarlowN, MillsB control the pore structure in the super-hard material ceramic grinding wheel to make the grinding wheel with high bond strength, good grinding efficiency and cooling performance during grinding. Through thermomechanical analysis and Raman spectroscopy, Kuan-HongLin, Shih-FengPeng and Shun-TiabLin studied the sintering shrinkage rate and diamond burning loss of superhard ceramic wheel with sintering temperature, sintering atmosphere and sintering time. The sintering parameters and grinding characteristics of the ceramic bond diamond grinding wheel were studied. The formula of super-hard material ceramic binder used by Russian scholars is mainly based on the chemical composition, and the boron glass or boron-lead glass system is selected as the theoretical research object. Lead glass binders have also been studied intensively, but lead is a toxic substance that decomposes easily at high temperatures.
As early as the 1990s, Japanese researchers studied the selection of grinding wheel concentration and abrasive grain requirements for high-precision and high-precision grinding of ceramic bond diamond wheels. Study on the grinding performance of super-hard material grinding wheel with borosilicate glass system binder with Na2O-B2O3-SiO2 as the basic component; the formulation of ceramic binder is mainly based on chemical composition, and choose boron glass or boron lead glass system as Theoretical research object.
In foreign studies, the study of toughening and strengthening of ceramic binders began. For example, the crystal phase of the binder was microcrystallized, and appropriate amount of whiskers were added to the binder. They found that the addition of silicon borate whiskers to the binder can inhibit the formation of cristobalite and prevent the cracking of the grinding wheel due to the rapid expansion of the cristobalite at 100 ° C to 200 ° C. On the other hand, the aluminum borate whisker It can itself act as a whisker reinforcement to increase the tensile strength of the bond.
From the domestic research reports on superhard material ceramic grinding wheels, the research directions are mainly:
Coating the surface of the superhard material abrasive particles to form a transition layer increases the adhesion of the bonding agent to the abrasive particles.
Using glass, ceramic and other related theories to discuss borosilicate glass with Na2O-B2O3-SiO2 as the basic component, the free oxygen provided by R2O or RO, the boron-oxygen triangle [BO3] is converted into boron oxygen composed entirely of bridging oxygen. The tetrahedron [BO4] transforms the structure of boron from a layered body into a three-dimensional space-like structure similar to a silicon tetrahedron [SiO4], thereby strengthening the network and making certain properties of the glass appear on the property curve. Maximum and minimum values. The high strength is only a characteristic index of the grinding wheel, and the performance indexes such as impact toughness and wear resistance of the grinding wheel market must also be considered.
The research of ceramic bond diamond mainly comes from several aspects, [1] research on low temperature, high strength and low expansion coefficient ceramic bond; [2] performance improvement of ceramic bond; [3] ceramic bond and diamond abrasive grain Inter-wetting research; [4] Research on surface modification of diamond abrasive grains; [5] Research on improvement of grinding wheel structure; [6] Research on optimum preparation parameters of grinding wheel; [7] Optimal grinding process parameters and grinding methods Research, etc.
Due to the combination of ceramic binder and diamond abrasive, the difficulty factor is relatively large, and the development and production of ceramic bond diamond grinding wheel has been hindered. The engineer of Henan Shengchuang Superhard Material Co., Ltd. overcomes the technical problem of ceramic bond diamond. The engineer is the first to produce the ceramic bond diamond grinding wheel for grinding gemstone in China, and has developed a variety of grinding wheel specifications, which has won the favor of gem processing. . In recent years, the grinding and grinding of PCD/PCBN tool ceramic bond diamond grinding wheel, grinding diamond composite ceramic bond diamond grinding wheel and other series of ceramic bond diamond grinding wheel has achieved good reputation in the market. ["Interpretation of the Performance of Different Bonding Agents for Diamond Wheels" provides a detailed analysis of the performance of diamond grinding wheels with different binders. At present, the ceramic bond diamond grinding wheel is far from playing its due role. The research and development room of Henan Shengchuang Superhard Material Co., Ltd. shoulders the performance of ceramic bond, the structure of the grinding wheel, the process parameters of the grinding wheel preparation, the grinding processing method and the process parameters. Further research is conducted to meet the urgent needs of the domestic market.
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